Prototype Business

Tianma Japan offers high reliability and quality products that utilizes own LCD manufacturing capability/know-hows, provides various type of film deposition, patterning and glass cutting, and can be a partner who can cooperate in the development of new technologies and new products in material, processing, machine manufacturers and research institutes.

Feature of prototype

• Integrated process (deposition, patterning, cutting)

• Maximum size of glass:550x660mm and thickness of glass:0.5mm or 0.7mm

• Various metal materials, inorganic insulating film materials, and organic insulating film materials are available

• Support small-quantity level trial production to mass production.

• Mounting IC, assembling FPC to glass are an option. Please let us know.

• Support design such as CAD works.

• Reliability test is an option. Please let us know.

• Measurement such as thickness of layer for samples is an option. Please let us know.

• Support the production of products not only LCD and the contract processing of prototypes using LCD manufacturing technology, equipment, and know-how.

Available process

■Substrate processing

Process		Equipment	Remarks
Available array		Purchased item	550x660mm 0.5t/0.7t
Cleaning		UV/Chemical/Brush/High pressure/Ultrasonic/Pure water
Deposition	Metal thickness:please refer following table	Sputter	AlNd, MoNb, ITO, Cr, Cu, etc.
	Insulator (inorganic) thickness:please refer following table	P-CVD	SiNx, SiOx, etc.
	Insulator (organic) thickness:please refer following table	Spin coater Slit coater	Acrylic resin (incl. for PS), Polyimide resin
	Semiconductor thickness:please refer following table	P-CVD, Sputter	a-Si, InGaZnO₄
Patterning Photolithography	Coating resist	Spin coater
	Exposure *Tianma Japan can support design	Aligner	Processing ability≥4μm Overlay accuracy≤±2μm
		Stepper	Processing ability≥4μm Overlay accuracy≤±2μm
		Proximity	Processing ability≥8μm Overlay accuracy≤±3μm
	Development	Development
	Etching	Dry etching	SiOx、SiNx、Cr
	Etching	Wet etching	AlNd、MoNb、ITO、Cu、Ag
	Stripping	Amine based treatment
High temperature annealing(bake)		Hot air circulation	O2 concentration can be adjusted by N2

CVD equipment slot	CVD equipment	ITO sputter

Photolithography equipment slot	Stepper	Dry etching equipment

Table1:Deposition material, Thickness, Line width, Resistance
Below is available type of material, thickness.

	Type	Thickness (nm)	Minimum line width / Spacing(μm)	Ratio value (μΩ·cm)	Remark
Wiring/ Electrode	AL alloy	30~500	4/5	5	With Mo Alloy lamination
	Mo alloy	30~300	4/4.5	16
	ITO (Transparent conductive)	40~150	4/5	165~800
	Cr	30~50	4/4	20
	Cu	30~200	4/9	3

Thickness, line width and spacing is just guideline.
Measurement such as thickness of layer for samples is an option. Please let us know.

Table2:Material, Thickness, Line width

	Type	Thickness (nm)	Minimum line width / Spacing(μm)	Remark
Insulator	SiNx	50~1000	5	Contact hole formation available
	SiOx	50~200	5
	Acrylic resin	1500~25000	10
	Polyimide resin	100~10000	10
	a-Si	10~250	5
	InGaZnO₄	30~200	5

Thickness, line width and spacing is just guideline. If you have request, please let us know.
Measurement such as thickness of layer for samples is an option. Please let us know.

■Post-process

Available contents	Equipment	Remark
Sealing	Dispensing	Seal width:0.5~2mm level
ODF (drop material, alignment for bi-pane and UV curing)	ODF equipment UV irradiation device	Alignment level:±6μm (370x470mm glass size only)
Thermosetting Seal material	Hot air circulation
Slimming	Chemical etching(outsource)	Up to 0.2t on one side
Cutting	Regular cutting machine Free form cutting machine	・tolerance:±0.3mm ・Please ask the cutting size and free form shape.
Polishing edge	Polishing machine
Cleaning	Neutral detergent & Pure water cleaning

■Bonding

Available contents	Equipment	Remark
Bonding	Film bonding device machine	Available size (middle size) 108x167~370x500mm Available size (large size) 200x300~650x650mm
Sensor & Touch panel bonding	Includes vacuum bonding UV curing treatment by OCR	Available size 87x142~325x490mm
Sensor & Touch panel bonding	OCA bonding
Touch panel bonding to LCD module	Includes vacuum bonding UV curing treatment by OCR
	OCA bonding
	Adhesive bonding